* 业界当前最薄的TD-LTE模块
* 采用中兴自研芯片平台，价格优于同类芯片平台
* 支持LTE多频
* 支持SIM卡业务
* 支持IPv4,IPv6协议
* 高速USB 2.0接口
* 支持HSIC接口
* 支持短信、数据、电话本、PCM语音功能
产品简介
ME3860为业界最薄的TD-LTE模块，兼容LGA typeII 封装设计，厚度仅为2.1mm，更加适用于对尺寸要求严格的应用场景。其采用的中兴通讯自研芯片平台Wisefone7510，是国内首款通过中国移动LTE多模芯片平台认证的28nm的LTE芯片平台。ME3860支持TD-LTE/TD-SCDMA/GSM三模八频，支持R9 LTE CAT4，下行速率最高可达150Mbps，上行速率50Mbps。产品配置
LTE TDD: band38,band39,band40,band41TD-SCDMA: band34,band39
GSM: 900MHz,1800MHz
产品应用行业
应用于路由器，超级本，笔记本电脑，平板，CPE，视频监控等领域。产品优势特点
●业界当前最薄的TD-LTE模块●高速USB 2.0接口
●支持HSIC接口
●支持短信、数据、电话本、PCM语音功能
●支持IPv4,IPv6协议
●支持SIM卡业务
●支持LTE多频
●采用中兴自研芯片平台，价格优于同类芯片平台
General Features
● LGA Form Factor (108pin)
● Dimensions: 36 mm x 26 mm x 2.1 mm
● Weight: approx. 4.1grams
● Supply voltage range 3.4V-4.2V (3.8V is recommended)
● Rx Diversity
● GSM/GPRS/EDGE Band 8 / Band 3
● TD-LTE
– Band38 : 2570~2620 MHz (Uplink/Downlink)
– Band39 : 1880~1920 MHz (Uplink/Downlink)
– Band40 : 2300~2400 MHz (Uplink/Downlink)
– Band41 : 2496~2690 MHz (Uplink/Downlink)
● TD-SCDMA
– Band34(A) : 2010~2025 MHz (Uplink/Downlink)
– Band39(F) : 1880~1920 MHz (Uplink/Downlink)
Electrical & Sensitivity
● Transmit Power:
–GSM/GPRS 900: 33±2dBm (Power Class 4)
–GSM/GPRS 1800: 30±2dBm (Power Class 1)
–EDGE 900: 27±3dBm (Power Class E2)
–EDGE 1800: 26 -4/+3dBm (Power Class E2)
–TD-LTE Band38 +23dBm(Power class 3 )
–TD-LTE Band39 +23dBm(Power class 3 )
–TD-LTE Band40 +23dBm(Power class 3 )
–TD-LTE Band41 +23dBm(Power class 3 )
–TD-SCDMA Band34 +24dBm(Power class 2 )
–TD-SCDMA Band39 +24dBm(Power class 2 )
● Power Consumption:
–Standby (Typical): TBD
–Maximum: TBD
Data Features
● TD-SCDMA : 2.8Mbps
● TD-SCDMA : 2.2Mbps
● TD-LTE : 50M/150Mbps(Uplink/Downlink)
● TD-LTE Bandwidth Supported: 5M,10M,15M,20M
● TD-SCDMA Protocol Supported: Rel 9
● LTE Protocol Supported: Rel 9
● TCP/IP Protocol Supported : IPv4,IPv6,IPv4/IPv6 Dual Stack
SMS Features
● Support Text and PDU mode
● Point to point MO and MT
● SMS Status Report SMS centre address setting
● Management of SMS: read, write, send, receive, delete, storage status, SMS list, new SMS alert
Interfaces
● USB 2.0 High speed interface
● SIM card interface (1.8/3.0V DC)
● UART interface
● RF Interface (pad for Primary and Diversity)
● Power-on /Power-off
● PCM Interface
● LED Interface
● I2C Interface
● Interactive Interface
● Reset
● HSIC Interface
Applications
● NDIS
● ECM
● SMS
● MMS
● Phonebook
● STK
● USSD
● Control Via AT Commands
Driver & Tools
● Improved power-saving mode
● NDIS/ USB Driver: Windows XP, Windows Vista, Windows 7
● ECM / USB Driver for Devices: based on Linux & Android
Environmental
● Operation temperature: -20°C to +60°C
● Extreme working temperature: -30°C to +70°C
● Storage temperature: -40°C to +85°C
● Humidity: 5%~ 95%
