美国UDM AKLC300系列浓缩晶圆切削液
l AKLC300洗涤剂浓缩液是一种可生物降解、水性、非碱性、非酸性物质
l PV wafer Cleaning after wafering
用于切片之后对光伏硅片进行清洗
l DI /RO water: Detergent dilution ratio – 1000:1 to 500 :1
去离子水/反渗透水:洗涤剂溶液比例 – 1000:1至500:1
l Application temperature: 45°C - 70°C
使用温度：45°C - 70°C
l Excellent wetting, cleaning and rinsing properties
极好的湿润、清洁和冲洗功能
l Water surface tension reducer
降低去离子水/反渗透水表面张力
l Completely cleans out SiC (silicon carbide) dust and other contaminants on wafer surfaces
可以彻底清洁硅片表面的碳化硅(SiC)尘埃以及其他脏污
l Cleans and eliminates Cu (Copper) and Fe (Iron) on PV wafer surfaces after wafering and De-gluing process.
在切片以及去胶工序之后彻底清除光伏硅片表面的铜和铁
l Biodegradable, non-hazardous and hence easily disposable
可生物降解、无危害，可以很容易进行处置
l Biochemical Oxygen Demand (BOD) < 2.0 mg/L (BOD less than 2.0 mg/L)
生化需氧量(BOD) < 2.0 mg/L (BOD小于2.0 mg/L)
l Chemical Oxygen Demand (COD) < 10.0 mg/L (COD less than 10.0 mg/L)
化学需氧量(COD) < 10.0 mg/L (COD小于10.0 mg/L)
