应用： RF800T松脂助焊剂的涂敷可用发泡、波峰、喷雾和雾化形式。助焊剂涂层的密度和均匀性，对免洗助焊剂成功地被应用是具关键性的影响。建议用密度为500到1500微克/平方英寸干的助焊剂涂层。预热使线路板上的助焊剂干燥，增强去除氧化物及优良焊点的形成。预热温度取决于各种因素，比如传送带速度、器件和基板的种类，进入波峰焊时，典型的顶面温度是88-150摄氏度，底面温度是121-163摄氏度。
Alpha RF 800T flux is formulated to be applied with foam, wave, spray and mist fluxers. Flux deposition, density and uniformity are critical to successful use of low solids no-clean flux. Applying RF 800T to a dry flux coating density of 100 to 300 micrograms per square centimetre is recommended. Preheating the circuit assembly will partially dry the flux, enhance oxide removal and promote optimum wicking, as well as superior solder joint formation. Degree of preheat is dependent on many variables; such as conveyor speed, type of components and substrates. Entering the solder wave with a top-side temperature of 90°C to 110°C and a bottom-side temperature of 120°C to 155°C is typical.
